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Suzhou Jufeng Electrical Insulation System Co., Ltd.

Jf-1851 Epoxy Encapsulating Compound manufacturer / supplier in China, offering Jf-1851 Epoxy Encapsulating Compound, Stator Coil, Wind Driven Coil and so on.

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Jf-1851 Epoxy Encapsulating Compound

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Product Description

1.Description
JF-1851 Epoxy encapsulating compound is an A-B dual-component system, which is composed of epoxy resin, anhydride curing agents, fillers, promoting agents and auxiliary agents. Part A and Part B shal be mixed up the proportion of 100:3 before pouring into the casting mold.
JF-1851 Epoxy encapsulating compound is featured in low viscosity, rational formula, advanced technology, excellent liquidity and valid period under 30  -60 . Application of this product is found in the pouring for dry type transformers with voltages up to 35KV, dry type discharging coils and voltage/current mutual inductors.
During the curing, JF-1851 Epoxy encapsulating compound is featured in low exothermic peak, small shrinkage and not easy to crack. The condensate of the product shows excellent electric and mechanical performance.
2.Technical parameters of the product
S/N
Names of Properties
Testing Conditions
Unit
Target Values
1
Appearance
∶Party A
   Party B
Bare eye observation
--
White sticky liquid, no existence of obvious deposit Brown and yellowish transparent liquid, no mechanical impurity
2
Viscosity
Party A
Rotation viscosity meter(50±1)
mPa·s
3000 ~  6000
Party B
#4 viscosity meter(23±1)
s
20 ~  30
3
Gel time
(130±2)
min
4 ~ 10
4
Impact strength
Room temperature
MPa
100 ~ 120
5
Volume resistivity
Room temperature
Ω·m
≥1.0×1013
6
Moisture absorption rate
Room temperature
24 h
%
≤0.1
7
Electric strength
Room temperature
MV/m
≥20
8
Storage period
 Under 25 , 
sealed and avoid light
Month
6

3.  Application process for reference
Pro-heating of pouring materials: preheat Part A and B separately in an 50  ~ 60  oven  for 2 to 3 hours.
Pre-baking of the workpiece∶                75 ~ 80         2h ~ 3 h
Seal the mold and vacuum the workpiece:
Feeding encapsulating compound∶                 50 ~ 60        20min ~ 30min
Drying∶  100 ~110       2h ~4 h
               130 ~ 140      3h ~6 h
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