JF-1851 Epoxy encapsulating compound is an A-B dual-component system, which is composed of epoxy resin, anhydride curing agents, fillers, promoting agents and auxiliary agents. Part A and Part B shal be mixed up the proportion of 100:3 before pouring into the casting mold.
JF-1851 Epoxy encapsulating compound is featured in low viscosity, rational formula, advanced technology, excellent liquidity and valid period under 30 -60 . Application of this product is found in the pouring for dry type transformers with voltages up to 35KV, dry type discharging coils and voltage/current mutual inductors.
During the curing, JF-1851 Epoxy encapsulating compound is featured in low exothermic peak, small shrinkage and not easy to crack. The condensate of the product shows excellent electric and mechanical performance.
2.Technical parameters of the product
Names of Properties
Bare eye observation
White sticky liquid, no existence of obvious deposit Brown and yellowish transparent liquid, no mechanical impurity
Rotation viscosity meter(50±1)
3000 ~ 6000
#4 viscosity meter(23±1)
20 ~ 30
4 ~ 10
100 ~ 120
Moisture absorption rate
Room temperature24 h
Under 25 ,
sealed and avoid light
Pro-heating of pouring materials: preheat Part A and B separately in an 50 ~ 60 oven for 2 to 3 hours.